Hermetic microminiature packages

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Details

357 74, 357 80, 357 73, H01L 2306, H01L 2314

Patent

active

049672606

ABSTRACT:
A hermetic tape package and a process for forming the hermetic tape package are disclosed. The package is capable of high lead densities and occupies a minimum of space. A test frame is incorporated into the package to permit testing of an electronic device prior to sealing the package.

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Article by G. Y. Y. Chen, entitled "Recent Advances in Laser Directed Imaging for PWBs" p. 41 of Jan. 86 edition Printed Circuit Fabrication.

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