Hermetic high frequency module and method for producing the...

Wave transmission lines and networks – Long lines – Waveguide type

Reexamination Certificate

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C343S872000

Reexamination Certificate

active

06958669

ABSTRACT:
The invention relates to a high frequency module with a hollow conductor structure, consisting of a housing bottom and a housing lid, preferably consisting of ceramic. The housing bottom and the housing lid are preferably coordinated with each other in terms of their expansion characteristics. The adjusting device is mounted on the housing lid for positioning on the housing bottom, and consists of a raised photosensitive resist part which tapers conically starting from the housing lid. The adjusting device engages with the hollow conductor on assembly. The layer thickness of the adjusting device is approximately 100 to 200 μm. The housing bottom and the housing lid are permanently interconnected by soldering, preferably using solders which are introduced galvanically in solder deposits. To this end, the solder is either applied locally to the housing lid surface or introduced in vias which are structured in the lid.

REFERENCES:
patent: 4843353 (1989-06-01), Sequeira
patent: 5574314 (1996-11-01), Okada et al.
patent: 2 717 981 (1995-09-01), None
patent: 62 037950 (1987-02-01), None

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