Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-05-26
1994-10-25
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 361749, 361762, 361780, 361807, 361809, H05K 111
Patent
active
053594967
ABSTRACT:
A body is hermetically sealed by electroplating a hermetic layer over the exterior surface of the body. A hermetic high density interconnect structure is provided by forming a continuous metal layer over the outermost dielectric layer of the multilayer interconnect structure and by disposing that continuous metal layer in a hermetically sealing relation to the substrate of the high density interconnect structure. A variety of techniques may be used for providing electrical feedthroughs between the interior and exterior of the hermetic enclosure as may a pseudo-hermetic enclosure in those situations where true hermeticity is not required.
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Eichelberger Charles W.
Kornrumpf William P.
Wojnarowski Robert J.
General Electric Company
Krauss Geoffrey H.
Picard Leo P.
Sparks Donald A.
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