Hermetic feedthrough terminal assembly with wire bond pads...

Details Hermetic feedthrough terminal assembly with wire bond pads... Hermetic feedthrough terminal assembly with wire bond pads...

2006-04-19

2009-11-24

Ha, Nguyen T (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S306100, C361S303000, C361S305000, C361S301200, C333S182000, C333S183000, C333S185000

Reexamination Certificate

active

07623335

ABSTRACT:
A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.

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