Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1984-10-12
1985-12-10
Grimley, A. T.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
29588, 357 75, H01L 2308
Patent
active
045581711
ABSTRACT:
The present invention deals with an improved hermetic enclosure impervious to moisture, suitable for single or multiple chips. The enclosure is sealable at a low temperature safe for the enclosed electronic components. In particular, the enclosure employs matching direct bond copper surfaces on the substrate and on the cover which may be sealed together with solder. The cover is of a high temperature material which may be transparent. Transparent materials such as fused quartz, or garnet, or sapphire are suitable. The enclosure is economical at both small sizes and relatively large sizes; and the transparent cover material permits for optical signalling into the package.
REFERENCES:
patent: 4262165 (1981-04-01), Ohwaki et al.
patent: 4322778 (1982-03-01), Barbour et al.
Chervenic Jack
Gantley Francis C.
Suconick David J.
Baker Carl W.
General Electric Company
Grimley A. T.
Lang Richard V.
Tone D. A.
LandOfFree
Hermetic enclosure for electronic components with an optionally does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hermetic enclosure for electronic components with an optionally , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetic enclosure for electronic components with an optionally will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-59920