Hermetic electric component package

Details Hermetic electric component package Hermetic electric component package

2006-04-11

2006-04-11

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C438S459000, C438S928000, C438S977000, C438S667000

Reexamination Certificate

active

07026223

ABSTRACT:
An electric component package having a base and a lid, the base and lid defining a hermetically sealed cavity therebetween for accommodating an electric component. The base includes at least one conductive via extending therethrough, allowing control and/or input/output (I/O) ports associated with the electric component to be coupled to the conducive vias to pass signals between the sealed cavity and the exterior of the package without passing through the junction between the base and lid. The electric component package can be produced at the wafer level using conventional silicon wafer integrated circuit manufacturing machinery prior to separating the wafer into a plurality of devices.

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