Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1988-04-12
1990-02-20
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 74, H01L 2302
Patent
active
049028545
ABSTRACT:
An electric circuit assembly (12) includes a ceramic tub (14) having a floor (16) and an integral side wall (18) around the perimeter thereof and extending upwardly therefrom. Copper lead frames (20, 22, 24), are directly and hermetically bonded to the bottom of the tub floor at apertures (40, 42, 44) therethrough. A semiconductor chip (38) is connected to the lead frames through the apertures in the floor of the tub. A top cover (36) is hermetically sealed to the top (32) of the side wall of the tub to close the tub and hermetically seal the semiconductor chip therein. A first copper ring (30) is directly bonded to the top of the side wall of the tub and a second copper ring (34) is directly bonded to the underside of the ceramic top cover, and the rings are subsequently welded to each other.
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"Over 50 Years of Experience with the Direct Bond Copper Process", Tegmen Corp., 1201 East Fayette St., Syracuse, N.Y. 13210.
Picard Leo P.
Tone David A.
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