Hermetic chip carrier compliant soldering pads

Details Hermetic chip carrier compliant soldering pads Hermetic chip carrier compliant soldering pads

1985-05-01

1987-02-03

Grimley, Arthur T.

Spring devices

Bendable along flat surface

Flexural support

267165, 361404, 361408, F16F 100

Patent

active

046404996

ABSTRACT:
Compliant soldering pads allow for expansion and contraction between an hermetic chip carriers (HCC) and printed wiring boards (PWB) due to coefficient of thermal expansion mismatch and prevent solder cracking which in turn causes electrical discontinuities. The pads allow for flexing in three axes.

REFERENCES:
patent: 3374400 (1968-03-01), Tabuchi et al.
patent: 3588618 (1971-06-01), Otte
patent: 3589000 (1971-06-01), Galli
patent: 4113298 (1978-09-01), Kopp
patent: 4363076 (1982-12-01), McIver

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