Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Patent
1999-02-05
2000-07-04
Hardy, David
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
257632, 257650, H01L 23544
Patent
active
060842881
ABSTRACT:
A fully hermetically sealed semiconductor chip and its method of manufacture. The semiconductor chip of the present invention is fully hermetically sealed on both sides and the edges thereof through the use of suitable coatings applied thereto, such as glass, to prevent an environmental attack of the semiconductor chip. The fully hermetically sealed semiconductor chip of the present invention does not require the use of a separate package for the hermetic sealing of the chip, thereby reducing the size of such a chip. The method of the manufacture of the semiconductor chip of the present invention provides a simple process for the fully hermetic sealing of both sides and the edges of the semiconductor chip without the use of a separate package.
REFERENCES:
patent: 4749631 (1988-06-01), Haluska et al.
patent: 4756977 (1988-07-01), Haluska et al.
patent: 4769345 (1988-09-01), Butt et al.
patent: 4821151 (1989-04-01), Pryor et al.
patent: 4866571 (1989-09-01), Butt
patent: 4967260 (1990-10-01), Butt
patent: 5014159 (1991-05-01), Butt
patent: 5128737 (1992-07-01), van der Have
patent: 5323051 (1994-06-01), Adams et al.
patent: 5336928 (1994-08-01), Neugebauer et al.
patent: 5455459 (1995-10-01), Fillion et al.
patent: 5481135 (1996-01-01), Chandra et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5547906 (1996-08-01), Badehi
patent: 5635766 (1997-06-01), Cain
patent: 5682065 (1997-10-01), Farnworth et al.
patent: 5903044 (1999-05-01), Farnworth et al.
Akram Salman
Farnworth Warren M.
Wood Alan G.
Hardy David
Micro)n Technology, Inc.
LandOfFree
Hermetic chip and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hermetic chip and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetic chip and method of manufacture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1488981