Hermetic chip and method of manufacture

Details Hermetic chip and method of manufacture Hermetic chip and method of manufacture

1996-03-12

1997-10-28

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

257794, 257758, 257632, H07C 2702

Patent

active

056820658

ABSTRACT:
A fully hermetically sealed semiconductor chip and its method of manufacture. The semiconductor chip of the present invention is fully hermetically sealed on both sides and the edges thereof through the use of suitable coatings applied thereto, such as glass, to prevent an environmental attack of the semiconductor chip. The fully hermetically sealed semiconductor chip of the present invention does not require the use of a separate package for the hermetic sealing of the chip, thereby reducing the size of such a chip. The method of the manufacture of the semiconductor chip of the present invention provides a simple process for the fully hermetic sealing of both sides and the edges of the semiconductor chip without the use of a separate package.

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