Hermetic cerglass and cermet electronic packages

Details Hermetic cerglass and cermet electronic packages Hermetic cerglass and cermet electronic packages

1989-03-10

1991-08-27

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H01L 2302

Patent

active

050435353

ABSTRACT:
The invention relates to a process for coating sintered cermet or cerglass articles with a metal or metal alloy. The process is particularly useful to eliminate pores and cavities from the surface of the article. During hermeticity testing, these pores and cavities trap tracer gas and result in an erroneous leak rate measurement. In one embodiment, the coated surfaces are subsequently coated with a second metal layer by immersion plating followed by electrolytic deposition. The process is particularly suited to the manufacture of cermet and cerglass components for semiconductor packages.

REFERENCES:
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patent: 4569692 (1986-02-01), Butt
patent: 4594770 (1986-06-01), Butt
patent: 4704626 (1987-11-01), Mahulikar et al.
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patent: 4761518 (1988-08-01), Butt et al.
patent: 4769345 (1988-09-01), Butt et al.
patent: 4805009 (1989-02-01), Pryor et al.
Military Standard 883C, Method 1014.5, entitled Seal, dated Aug. 25, 1983, pp. 1-9.
Metals Handbook (Ninth Edition), vol. 5, Surface Cleaning and Coating, 1982, pp. 300-302.

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