Hermetic cavity package

Details Hermetic cavity package Hermetic cavity package

2007-07-17

2007-07-17

Fahmy, Wael (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C257S711000, C257S787000, C257SE23128, C257SE23059

Reexamination Certificate

active

11174268

ABSTRACT:
A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers (16, 22) are formed between and hermetically seal the first and second packaging layers (12, 28). First and second conductive strips (18, 20) are formed between the LCP layers (16, 22) and extend into the cavity. An electronic device (24) is positioned within the cavity and is coupled to the first and second conductive strips (18, 20).

REFERENCES:
patent: 4961106 (1990-10-01), Butt et al.
patent: 7136594 (2006-11-01), Nakanishi et al.
patent: 2004/0207059 (2004-10-01), Hong
patent: 2004/0207077 (2004-10-01), Leal et al.
patent: 2004/0211506 (2004-10-01), Wang et al.
patent: 2004/0214374 (2004-10-01), Sakamoto et al.
Xuefeng Wang et al., Micromachining Techniques For Liquid Crystal Polymer, IEEE, 2001 p. 126-130.
Rogers Corporation, Rogers R/flex® 3000 Liquid Crystalline Polymer Circuit Material R/flex® 3850 Double Clad Laminate, Data Sheet RF1.3850, 2003 Publication #14-021, Advanced Circuit Materials Division, Chandler, AZ.

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