Hemt structure with passivated donor layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...

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257194, 257283, H01L 2980

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active

051721970

ABSTRACT:
A channel layer, donor layer, Schottky layer, and cap layer are formed on a substrate. A source and drain are formed on the cap layer. A gate is formed on the cap layer, or at the bottom of a recess which is formed through the cap layer and partially extends into the Schottky layer. The donor and Schottky layers are formed of a semiconductive material which includes an oxidizable component such as aluminum. A passivation or stop layer of a lattice-matched, non-oxidizable material is formed underlying the source, drain, and gate, and sealingly overlying the donor layer. The stop layer may be formed between the Schottky layer and the donor layer, or constitute a superlattice in combination with the Schottky layer consisting of alternating stop and Schottky sublayers. Alternatively, the stop layer may sealingly overlie the Schottky layer, and further constitute the cap layer.

REFERENCES:
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patent: 4780748 (1988-10-01), Cunningham et al.
patent: 4862228 (1989-08-01), Ralph
patent: 4914488 (1990-04-01), Yamane et al.
A New Fabrication . . . Nonalloyed Ohmic Contacts IEEE vol. 36 No. 10 Oct. 1989.
Double Heterostructure GaInAs MESFETs by MBE IEEE vol. EDL-1 No. 8 Aug. 1980.
Modulation doped MBE GaAs
-AlGaAs MESFET IEEE vol. EDL-2 No. 1 Jan. 1981.
"Ultra-High-Speed Digital Circuit Performance in 0.2 .mu.m Gate-Length AlInAs/GaInAs HEMT Technology", U. Mishra et al., IEEE Electron Device Letters, vol. 9, No. 9, Sep. 1988, pp. 482-484.
"A New Low-Noise AlGaAs/GaAs 2 DEG FET with a Surface Undoped Layer", Hida et al., IEEE Transactions on Electron Devices, May, No. 5, vol. ED-33, pp. 601-607.
"A New GaAs Technology for Stable FET's at 300.degree. C." by K. Fricke, et al. IEEE Electron Device Letters, vol. 10, No. 12, pp. 577-579 (Dec. 1989).

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