Helical microelectronic contact and method for fabricating same

Details Helical microelectronic contact and method for fabricating same Helical microelectronic contact and method for fabricating same

2005-09-27

2005-09-27

Nguyen, Truc T. T. (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S081000, C324S754090, C174S657000

Reexamination Certificate

active

06948940

ABSTRACT:
A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

REFERENCES:
patent: 6659778 (2003-12-01), Li
patent: 6672876 (2004-01-01), Takekoshi

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