Height measuring system

Measuring and testing – With fluid pressure – Dimension – shape – or size

Patent

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Details

73 376, 324 73PC, G01B 1316, G01R 3102

Patent

active

046075259

ABSTRACT:
The invention of this disclosure is a profiling and testing system that uses an air probe to determine the contour of a wafer containing a plurality of dies so that an electrical sensor may automatically step from die to die and test the completed dies in the wafer.

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patent: 4158171 (1979-06-01), Abbe et al.
patent: 4179919 (1979-12-01), McKechnie
patent: 4206633 (1980-06-01), McKechnie et al.
patent: 4491787 (1985-01-01), Akiyama et al.

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