Heel grounding device

Electricity: electrical systems and devices – Discharging or preventing accumulation of electric charge – Specific conduction means or dissipator

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

36136, H05F 302

Patent

active

051842750

ABSTRACT:
A heel grounding device (10) is disclosed which is used in connection with electrically grounded conductive flooring which in one embodiment is secured to the shoe (12) of a human operator. A strap (24) is secured about the leg (11) of the operator with conductive material (29) touching the operator. Grounding lead (25) attaches by a fastener (27) from conductive material (29) to partially conductive material (20) which is secured to the heel (15) of the shoe (12) of the operator. A strap (23) is used to secure the device onto the shoe (12) of the operator. Metal rivets (31, 32, 33) are secured in and protrude from partially conductive erlement so as to maintain electrical contact with the conductive grounded flooring to overcome soil build up on partially conductive material (20) and thereby maintain electrical grounding of the operator.

REFERENCES:
patent: 101602 (1870-04-01), Fanyou
patent: 2712098 (1955-06-01), Legge
patent: 3015754 (1962-01-01), Legge
patent: 3274442 (1966-09-01), Peel
patent: 3544841 (1970-12-01), Peel
patent: 3846921 (1974-11-01), Kobayashi
patent: 3912973 (1975-10-01), Young
patent: 4551783 (1985-11-01), Cohen et al.
patent: 4639825 (1987-01-01), Briedegam

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Heel grounding device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heel grounding device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heel grounding device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-10627

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.