Heatspreader for single-device and multi-device modules

Details Heatspreader for single-device and multi-device modules Heatspreader for single-device and multi-device modules

2006-05-22

2008-07-08

Datskovskiy, Michael V (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S700000, C361S710000, C361S715000, C165S080300, C165S080400, C165S185000, C257S717000, C257S718000, C174S016100, C174S252000

Reexamination Certificate

active

07397664

ABSTRACT:
A heatsink includes a heatsink base, an elastomeric base, multiple slider pins and an alignment frame coupled to the heatsink base. The elastomeric base includes multiple holes, the elastomeric base coupled to the perimeter of the heatsink base. Each of the slider pins secured in one of the holes in the elastomeric base. The alignment frame supporting and aligning the slider pins as the slider pins move in a direction substantially perpendicular to the heatsink base. A method of assembling a heat spreader is also described.

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The Article: “Liquid Cooled Module With Compliant membrane”, IBM Technical Disclosure Bulletin, Jul. 1977, vol.# 20; Issue#:2; pp. 673-674.

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