Heatsinking of optical subassembly and method of assembling

Optical communications – Transmitter and receiver system – Including optical circuit board

Reexamination Certificate

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Details

C398S135000, C398S138000, C385S014000, C385S092000, C361S702000

Reexamination Certificate

active

10761106

ABSTRACT:
An optical transceiver has a housing, a circuit board, an optical subassembly and a heat wick. The circuit board is configured to be received within the housing. The optical subassembly has a can and a barrel, and the optical subassembly is mechanically supported on the housing and electrically coupled to the circuit board. The heat wick is thermally coupled between the can of the optical assembly and the housing.

REFERENCES:
patent: 4547039 (1985-10-01), Caron et al.
patent: 5032898 (1991-07-01), Bowen et al.
patent: 5631987 (1997-05-01), Lasky et al.
patent: 6200041 (2001-03-01), Gaio et al.
patent: 6445475 (2002-09-01), Okubora et al.
patent: 6526206 (2003-02-01), Kunkel et al.
patent: 6655855 (2003-12-01), Nakura et al.
patent: 6659657 (2003-12-01), Lin et al.
patent: 2003/0180012 (2003-09-01), Deane et al.
patent: 2004/0062491 (2004-04-01), Sato et al.
patent: 2005/0007741 (2005-01-01), Ice et al.
patent: 0 678 765 (1995-10-01), None
patent: 1 227 349 (2002-07-01), None
patent: 1 237 025 (2002-09-01), None
patent: 56030111 (1981-03-01), None

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