Heatsinking and packaging of integrated circuit chips

Details Heatsinking and packaging of integrated circuit chips Heatsinking and packaging of integrated circuit chips

2005-11-08

2005-11-08

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S708000, C257S709000, C257S710000, C257S711000, C257S712000, C257S713000

Reexamination Certificate

active

06963130

ABSTRACT:
A semiconductor package has a printed circuit board, an integrated circuit chip on the printed circuit board with an exposed semiconductor die, and a rigid structure secured to the printed circuit board and enclosing the exposed semiconductor die. The exposed surface of the semiconductor die placed is in thermal contact with an inner surface of the rigid structure with a compressible material.

REFERENCES:
patent: 5926371 (1999-07-01), Dolbear
patent: 6411507 (2002-06-01), Akram
patent: 6504243 (2003-01-01), Andric et al.

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