Heatsink with periodically patterned baseplate structure

Details Heatsink with periodically patterned baseplate structure Heatsink with periodically patterned baseplate structure

2009-08-06

2010-12-07

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C165S080300, C165S185000

Reexamination Certificate

active

07848108

ABSTRACT:
A heatsink including an electromagnetic bandgap structure reduces electromagnetic interference caused by an integrated circuit in an electronic device. One embodiment provides a heatsink having a base with an array of electrically-conductive, thermally-conductive patches spaced apart in two dimensions of a reference plane and having a thickness perpendicular to the reference plane. The patches are interconnected by a plurality of branches. Each branch connects adjacent patches and has a width in the reference plane of less than a width of each adjacent patch. A plurality of thermally conductive cooling fins coupled to a surface of the base and extend normal to the reference plane. The cooling fins may be formed of a thermally-conductive, electrically non-conductive material or may be coupled to the base by a thermally-conductive, electrically non-conductive material. The periodically patterned structure of the base, together with a solid metal layer of a circuit board, form an electromagnetic bandgap structure that reduces certain frequencies of electromagnetic noise caused by the integrated circuit.

REFERENCES:
patent: 6437438 (2002-08-01), Braasch
patent: 6563198 (2003-05-01), Caldwell
patent: 6947294 (2005-09-01), Lin et al.
patent: 7405698 (2008-07-01), de Rochemont
patent: 7463213 (2008-12-01), Nakano et al.
patent: 7748440 (2010-07-01), Michel et al.
patent: 2008/0303121 (2008-12-01), Lin et al.
Doctoral Thesis by: Felix Djebe Mbairi, “Some Aspects of Advanced Technologies and Signal Integrity Issues in High Frequency PCTs, With Emphasis on Planar Transmission Lines and RF/Microwave Filters”, Stockholm, 2007 Sweden, pp. 1-96.

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