Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-09-20
2004-12-07
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S709000, C361S712000, C257S714000, C165S080300
Reexamination Certificate
active
06829143
ABSTRACT:
BACKGROUND AND RELATED ART
Thermal dissipation devices are utilized in a wide variety of applications, including electronic apparatus such as computers, stereos, televisions, or any other device that produces unwanted heat by inefficiencies in electronic circuits, such as integrated circuit chips (ICs), including microprocessors. Such devices generally employ conduction, convection, or a combination of conduction and convection to dissipate heat generated by a heat source. Conduction is the transfer of heat by the movement of heat energy from a high temperature region to a low temperature region in a body. Convection is the transfer of heat from the surface of a body by the circulation or movement of a liquid or gas over the surface. A heatsink is a thermal dissipation device, typically comprising a mass of material (generally metal) that is thermally coupled to a heat source and draws heat energy away from the heat source by conduction of the energy from a high-temperature region to a low-temperature region of the metal. The heat energy can then be dissipated from a surface of the heatsink to the atmosphere primarily by convection.
An integrated circuit may be closely associated with a heat transfer system that removes heat from the circuit. An integrated circuit die may be packaged and the package may be coupled to a heat transfer device. Alternatively, the die may be exposed for direct contact by the heat transfer device. Heat transfer components may be active or passive. For example, an active heat transfer component includes a fan which forces air over the integrated circuit to increase its rate of heat transfer. A passive heat transfer component includes a heatsink with desirable heat transfer characteristics. Combinations of active and passive heat transfer devices are commonly utilized in heat transfer systems.
The heatsink may be secured to a circuit board in a variety of manners including, for example, clips and screws. The retention mechanism is designed to satisfy several thermal and mechanical requirements. The heatsink should maintain a satisfactory thermal interface with the component. The retention mechanism should also be able to withstand shock and/or vibration as may be expected to occur for the particular application.
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Flamm Ron
Russell Mark C.
Datskovskiy Michael
Steiner Paul E.
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