Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-09-03
1999-06-08
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361692, 361702, 361704, 361719, 361720, 257718, 257719, 257722, 165 803, 174 161, 174 163, H05K 720
Patent
active
059108843
ABSTRACT:
An air duct structure for use in cooling a circuit card comprised of a printed circuit board to which an integrated circuit is connected. The air duct structure includes an air duct cover and a spring. The air duct cover includes a major panel that is sized or dimensioned to substantially cover the circuit card. First and second side panels extending substantially perpendicularly from opposing ends of the major panel to form a bracket. A depth of the bracket is suitable for receiving the circuit card and a heatsink positioned in close contact with the integrated circuit. When the circuit card and the heatsink are suitably received within the air duct cover, the air duct cover and the printed circuit board define an air duct within which the heatsink resides. The spring is attached to an interior surface of the major panel. The spring is positioned on the major panel to contact the heatsink and retain the heatsink in the close contact with the integrated circuit when the heatsink and the circuit card are suitably received by the air duct cover.
REFERENCES:
patent: 4115836 (1978-09-01), Hutchison et al.
patent: 4945448 (1990-07-01), Bremenour et al.
patent: 5243218 (1993-09-01), Zenitani et al.
patent: 5247425 (1993-09-01), Takahasi
patent: 5305185 (1994-04-01), Samarov et al.
patent: 5424913 (1995-06-01), Swindler
patent: 5526229 (1996-06-01), Wakabayashi et al.
patent: 5812375 (1998-09-01), Casperson
Garza Jose Arturo
Kent Dales Morrison
Ramirez Ciro Neal
Sinha Rajeev Ranjan
Chervinsky Boris L.
International Business Machines - Corporation
Lally Joseph
Leeuwen Leslie Van
Picard Leo P.
LandOfFree
Heatsink retention and air duct assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heatsink retention and air duct assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heatsink retention and air duct assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1686246