Heatsink retention and air duct assembly

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361692, 361702, 361704, 361719, 361720, 257718, 257719, 257722, 165 803, 174 161, 174 163, H05K 720

Patent

active

059108843

ABSTRACT:
An air duct structure for use in cooling a circuit card comprised of a printed circuit board to which an integrated circuit is connected. The air duct structure includes an air duct cover and a spring. The air duct cover includes a major panel that is sized or dimensioned to substantially cover the circuit card. First and second side panels extending substantially perpendicularly from opposing ends of the major panel to form a bracket. A depth of the bracket is suitable for receiving the circuit card and a heatsink positioned in close contact with the integrated circuit. When the circuit card and the heatsink are suitably received within the air duct cover, the air duct cover and the printed circuit board define an air duct within which the heatsink resides. The spring is attached to an interior surface of the major panel. The spring is positioned on the major panel to contact the heatsink and retain the heatsink in the close contact with the integrated circuit when the heatsink and the circuit card are suitably received by the air duct cover.

REFERENCES:
patent: 4115836 (1978-09-01), Hutchison et al.
patent: 4945448 (1990-07-01), Bremenour et al.
patent: 5243218 (1993-09-01), Zenitani et al.
patent: 5247425 (1993-09-01), Takahasi
patent: 5305185 (1994-04-01), Samarov et al.
patent: 5424913 (1995-06-01), Swindler
patent: 5526229 (1996-06-01), Wakabayashi et al.
patent: 5812375 (1998-09-01), Casperson

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