Heatsink mounting system

Details Heatsink mounting system Heatsink mounting system

2008-12-23

2010-12-07

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S710000, C361S719000, C165S121000, C165S185000, C257S719000

Reexamination Certificate

active

07848107

ABSTRACT:
A heatsink system (10) is provided for containing and engaging a heatsink (16) against a heat generating component, typically an IC chip (18). The system (10) includes a rectangular integrally formed resilient frame (12) defining a cavity (26) in which the heatsink (16) is contained. The frame (12) includes a pair of opposed lateral sides (30) and a pair of opposing gripping sides (28) with L-shaped corner blocks (32) depending from the intersections thereof. The gripping sides (28) include centrally positioned grip handles (38) extending upward and grip blocks (34) depending therefrom, each grip block (34) having a grip tongue (36) at the lower extent thereof extending inward into the cavity (26). Inward pressure on the grip handles (38) forces the grip tongues (36) outward to release objects captured thereby.

REFERENCES:
patent: 5307239 (1994-04-01), McCarty et al.
patent: 5495392 (1996-02-01), Shen
patent: 5579205 (1996-11-01), Tustaniwsky
patent: 5603374 (1997-02-01), Wu
patent: 5677829 (1997-10-01), Clemens
patent: 5898571 (1999-04-01), Mertol
patent: 5932925 (1999-08-01), McIntyre
patent: 6153932 (2000-11-01), Liang
patent: 6311766 (2001-11-01), Lin et al.
patent: 6401807 (2002-06-01), Wyler et al.
patent: 6476484 (2002-11-01), Liang
patent: 6644396 (2003-11-01), Liang
patent: 6707672 (2004-03-01), Liu
patent: 6707674 (2004-03-01), Bryant et al.
patent: 7567435 (2009-07-01), Azar et al.
patent: 7619892 (2009-11-01), Liang
patent: 7697299 (2010-04-01), Desrosiers et al.
patent: 2001/0028552 (2001-10-01), Letourneau
patent: 2003/0011995 (2003-01-01), Liang
patent: 2003/0103332 (2003-06-01), Sopko et al.
patent: 2006/0198107 (2006-09-01), Azar
patent: 2009/0040729 (2009-02-01), Deng et al.
European Search Report mailed Jun. 4, 2010 for corresponding EPO case 09178738.2, citing the US patents and publications identified about (publication 1 has matured into patent 1). No Specific portions of the cited references were identified in the report.

Affiliated with

Also associated with

Rating

Heatsink mounting system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heatsink mounting system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heatsink mounting system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4224395