Heatsink for contact with multiple electronic components mounted

Details Heatsink for contact with multiple electronic components mounted Heatsink for contact with multiple electronic components mounted

1992-07-22

1994-04-26

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 803, 174 163, 257718, 361818, H05K 720

Patent

active

053072367

ABSTRACT:
A heatsink to remove heat dissipated by electronic components mounted on a circuit board comprises a thermally conductive material plate disposed over the components and attached by fixing mean near each component. The plate comprises spherical deformations facing the components and each deformation is in thermal contact with the heat source of a respective component.

REFERENCES:
patent: 3996447 (1976-12-01), Bouffard
patent: 3996604 (1976-12-01), Kimura
patent: 4259685 (1981-03-01), Romano
patent: 4342068 (1982-07-01), Kling
patent: 4648008 (1987-03-01), Neyroud
patent: 4674005 (1987-06-01), Lacz
patent: 4845590 (1989-07-01), Mikolajczak
patent: 5019940 (1991-05-01), Clemens
patent: 5031028 (1991-07-01), Galich

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