Heatsink for actively cooled daughterboard system

Details Heatsink for actively cooled daughterboard system Heatsink for actively cooled daughterboard system

2000-06-29

2001-09-25

Picard, Leo P. (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S690000, C361S694000, C361S695000, C361S707000, C361S719000, C257S718000, C257S719000, C257S721000, C174S016100, C174S016300, C165S080300, C165S185000

Reexamination Certificate

active

06295202

ABSTRACT:

FIELD OF THE INVENTION
This invention relates generally to cooling techniques for electronic circuitry. More particularly, the invention relates to techniques for cooling electronic components that are mounted on a daughterboard.
BACKGROUND
Computer-related electronic systems are commonly constructed using multiple interconnected circuit boards. The largest of these circuit boards is typically called the motherboard. Ancillary circuit boards such as CPU cards, memory cards and input/output cards are typically called daughterboards. Sockets are provided on the motherboard for receiving one or more daughterboards and making appropriate electrical connections between components mounted on the daughterboards and those mounted on the motherboard. Such sockets are usually designed so that the daughterboards may be easily removed and replaced.
Special thermal management problems are presented by motherboard/daughterboard systems wherein high heat dissipation components are mounted on the daughterboards. Specifically, it has been found that fan-driven heat sinks are necessary to prevent the high heat dissipation components such as CPU chips on the daughterboards from overheating.
One example of such a motherboard/daughterboard system is described in the single edge contact cartridge (“SECC”) packaging specifications promulgated by Intel Corporation. Referring now to
FIG. 1
, the packaging specification for boxed SECC
2
processors describes a daughterboard
100
on which a CPU is mounted. Daughterboard
100
is adapted to engage a socket
102
on a motherboard
104
so that daughterboard
100
is oriented substantially perpendicular to motherboard
104
. A heatsink
106
is disposed on one side of daughterboard
100
between the CPU and a fan
108
. On the opposite side of daughterboard
100
, an SECC
2
cover plate
110
is provided to help anchor heatsink
106
to daughterboard
100
. Heatsink
106
is generally rectangular and includes plural elongate fins
112
. Each of fins
112
lies on a plane that is substantially parallel to motherboard
104
. The axis of rotation of fan
108
is also substantially parallel to motherboard
104
. A fan shroud
114
is provided to direct air flow through heatsink
106
from the ends of fins
110
to the middle of fins
110
under fan
108
as shown in FIG.
2
.
Heatsink
106
also includes tabs
116
on either end. (Tabs
116
are best illustrated in
FIG. 3.
) Each of tabs
116
defines a notch
118
for engaging a retaining member of socket
102
. An example of such a retaining member is universal retention mechanism
400
(“URM”) shown in FIG.
4
. URM
400
includes a frame with top surfaces
406
and a resilient arm
402
. Resilient arm
402
includes retaining ledges
404
. Typically, one URM
400
is disposed on each end of socket
102
with its retaining ledges
404
facing inward toward the socket. When daughterboard
100
is pushed into socket
102
, notches
118
on either side of heatsink
106
engage the underside of ledges
404
, thereby helping to retain daughterboard
100
in socket
102
.
SUMMARY OF THE INVENTION
A heatsink for use with a daughterboard system may include plural radial fins integrally formed with a base portion. Each of the fins may be oriented transversely relative to the base portion. The base portion may include a central portion that is thicker than the end portions. The thickness of the base portion, as well as the profile formed by the outer ends of the fins, may vary according to the radius of the fins. The thickest part of the base portion should preferably be disposed over a heat dissipating device on the daughterboard, such as a CPU chip.


REFERENCES:
patent: 5828551 (1998-10-01), Hoshino et al.
patent: 5982622 (1999-11-01), Chiou
patent: 6064574 (2000-05-01), Yu et al.
patent: 6097601 (2000-08-01), Lee
patent: 6101091 (2000-08-01), Baik
patent: 6104609 (2000-08-01), Chen
patent: 6141220 (2000-10-01), Lin

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