Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-04
2007-12-04
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S719000, C174S015200, C165S080400, C165S104210, C257S715000
Reexamination Certificate
active
11057335
ABSTRACT:
Disclosed is a heatsink device of video graphics array (VGA) and chipset. The main characteristic is making an integrated design for heatsink devices. Using a heatsink plate stacks on VGA and chipset instead of several ones as before. The heatsink plate has more heat dissipation area than that of conventional heatsink. The device also integrates other heat generated elements stacking below the heatsink plate to dissipating more heat, so as to increase heat dissipation effect of the heatsink plate. The device makes the operation of VGA and chipset more effectively and increases their life-time.
REFERENCES:
patent: 5930115 (1999-07-01), Tracy et al.
patent: 6504711 (2003-01-01), Wu et al.
patent: 6549404 (2003-04-01), Kitahara et al.
patent: 6708754 (2004-03-01), Wei
patent: 6717811 (2004-04-01), Lo et al.
patent: 6883594 (2005-04-01), Sarraf et al.
patent: 6937474 (2005-08-01), Lee
patent: D509806 (2005-09-01), Lee et al.
patent: 7019974 (2006-03-01), Lee et al.
patent: 7209356 (2007-04-01), Lee et al.
Fan Jui-Chan
Wang Frank
Chervinsky Boris
Inventec C'orporation
Morris Manning & Martin LLP
Tingkang Xia, Esq. Tim
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