Heatsink device and method

Details Heatsink device and method Heatsink device and method

2005-08-30

2005-08-30

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C174S016300, C257S706000, C257S722000

Reexamination Certificate

active

06937473

ABSTRACT:
A method and device for thermal conduction is provided. Methods of forming heatsinks are provided that include advantages such as the ability to produce intricate detailed features that other manufacturing methods are not capable of. Other advantages provided include a reduction in process time and cost due to the absence of a need to machine components after initial fabrication. Embodiments of heatsinks that are formed using methods provided include features such as sub-fins and other detailed features that cannot be formed using other manufacturing processes. Further embodiments of heatsinks that are formed using methods provided include materials that cannot be formed using other manufacturing processes.

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patent: 6714415 (2004-03-01), Shah
patent: 2003/0024693 (2003-02-01), Petty et al.

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