Heatsink buffer configuration

Heat exchange – Heat transmitter

Reexamination Certificate

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Details

C165S080300, C257S720000, C361S704000

Reexamination Certificate

active

06918437

ABSTRACT:
A heat sink buffer10is provided, including a backplate20defining a heat transfer passage24. A thermally conductive buffer element22is positioned within and secured to the heat transfer passage24to provide a thermal conduit through the backplate20.

REFERENCES:
patent: 3735485 (1973-05-01), Wilson
patent: 5617294 (1997-04-01), Watson et al.
patent: 5886407 (1999-03-01), Polese et al.
patent: 6064573 (2000-05-01), Morton
patent: 6114048 (2000-09-01), Jech et al.
patent: 6188579 (2001-02-01), Buondelmonte et al.
patent: 6262477 (2001-07-01), Mahulikar et al.
patent: 6295200 (2001-09-01), Schmidt
patent: 6355362 (2002-03-01), Jones et al.
patent: 6411516 (2002-06-01), Palumbo et al.

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