Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-02-09
2008-12-23
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S709000, C361S711000, C165S080200, C165S185000, C174S016300, C257S718000
Reexamination Certificate
active
07468888
ABSTRACT:
A heatsink assembly structure is provided. The heatsink assembly structure includes a heat conducting board attached to a heat-generating element, pressing members fixed to the heat conducting board, and spring plates penetrating through the heat conducting board. A plurality of through holes symmetric about the heat-generating element is formed in the heat conducting board in pairs. Two ends of the spring plates penetrate through the through holes, and are fixed to the pressing members between the through holes. When the spring plates are fixed to the circuit board, the spring plates apply forces that pull the heat conducting board towards the circuit board at positions of the pressing members, so as to push the heat conducting board against the heat-generating element to conduct heat to the heat conducting board. Thus, a plurality of forces pressing the heat conducting board downward is provided with a simple structure.
REFERENCES:
patent: 6239974 (2001-05-01), Tseng
patent: 6449157 (2002-09-01), Chu
patent: 7019976 (2006-03-01), Ahmad et al.
patent: 7072184 (2006-07-01), Kalyandurg
patent: 2008/0128899 (2008-06-01), Mlotkowski
Gandhi Jayprakash N
Inventec C'orporation
Pape Zachary M
Rabin & Berdo P.C.
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