Heatsink assembly for a high-power device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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174 163, 361710, 361814, 381 87, 381 90, H05H 720

Patent

active

057711542

ABSTRACT:
A heatsink assembly (100) provides additional heat dissipation for a high-power integrated circuit package (102) contained within a communication product housing (130). There is an integral heatsink (104) protruding from the package. The heatsink frictionally mates with the first end (108) of a thermally conductive member (106). The second end (110) of the conductive member is magnetically-coupled to the rear surface (123) of a loudspeaker magnet (122). Tabs (111) extending away from the second end of the conductive member provide added mechanical support, preventing the second end from sliding against the rear surface of the magnet. Heat generated by the high-power device is transferred from the package heatsink, via the thermally conductive member, to the loudspeaker magnet such that heat is dissipated away from the package and toward the magnet.

REFERENCES:
patent: 3991286 (1976-11-01), Henricksen
patent: 4138593 (1979-02-01), Hasselbach et al.
patent: 4210778 (1980-07-01), Sakurai et al.
patent: 4590332 (1986-05-01), Delbuck
patent: 4811403 (1989-03-01), Herricksen et al.
patent: 5533132 (1996-07-01), Button

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