Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-04-10
2007-04-10
Datskovosky, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S709000, C361S719000, C165S080300, C165S104330
Reexamination Certificate
active
10876473
ABSTRACT:
A heatsink assembly is disclosed that includes a holder slidably engaging a circuit board component to be cooled and a heatsink secured to the heatsink holder. A method of cooling a circuit board component is also disclosed that involves the steps of providing a bracket having a central portion and first and second end portions directed toward one another, sliding the bracket over a portion of a circuit board component to be cooled such that the central portion faces a first surface of the circuit board component and the first and second end portions face opposing edges of the circuit board component, providing a heatsink, and securing the heatsink to the bracket in a manner that retains the heatsink and bracket on the circuit board component.
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Emulation Technology—Snap-on BGA Heatsinks; pp. 1-3.
The news and products Journal for the Electronics Industry; “Canadian Electronics”; vol. 17, No. 3; May 2002.
Ciena Corporation
Datskovosky Michael
Hoffberg Robert J.
McGrath, Geissler Olds & Richardson, PLLC
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