Heatsink assembly

Details Heatsink assembly Heatsink assembly

2005-04-26

2005-04-26

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S719000, C257S718000, C024S458000, C248S510000

Reexamination Certificate

active

06885557

ABSTRACT:
A system assembly for the retention of heatsinks, in particular, high-mass heatsinks, is disclosed. The system assembly includes a backplate with standoffs extending transverse to a system board, for securing a heatsink to the system board. The standoffs effectively distribute the mass of the heatsink away from the system board, the processor, and socket, minimizing damage to these components. A TIM spring disposed within the backplate provides upward pressure to the system assembly to uniformly spread a thermal interface material between the processor and the heatsink, thereby facilitating effective heat transfer.

REFERENCES:
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5883783 (1999-03-01), Turturro
patent: 6008990 (1999-12-01), Liu
patent: 6046905 (2000-04-01), Nelson et al.
patent: 6141220 (2000-10-01), Lin
patent: 6154365 (2000-11-01), Pollard et al.
patent: 6243266 (2001-06-01), Lo
patent: 6307747 (2001-10-01), Farnsworth et al.
patent: 6381136 (2002-04-01), Nelson et al.
patent: 6746270 (2004-06-01), Peterson et al.

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