Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-08-13
2000-02-01
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
16510433, 174 152, H05K 720
Patent
active
060210443
ABSTRACT:
A heatsink assembly for removing at least some of the heat produced by an electronic component during use includes a heatsink, a heatpipe mounted on the heatsink and a plurality of thin, elongated fins mounted on the heatpipe. The heatsink is an elongated, generally rectangularly-shaped body and comprises a bottom surface, a top surface and a central, cylindrical channel formed in the top surface. A pair of clip recesses are formed in the top surface of the heatsink on opposite sides of the central channel. A first set of thin, elongated fins and a second set of thin, elongated fins are also formed in the top surface of the heatsink and serve to remove at least some of the heat transferred onto the heatsink. The heatpipe comprises an evaporator section and a condenser section. The evaporator section of the heatpipe is disposed tightly within the central channel of the heatsink so as to maximize the transfer of heat from the heatsink to the heatpipe. The plurality of thin, elongated fins are disposed on the condenser section of the heatpipe in a closely spaced parallel relation and serve to remove at least some of the heat transferred onto the heatpipe.
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patent: 5549155 (1996-08-01), Meyer, IV et al.
patent: 5826645 (1998-10-01), Meyer, IV et al.
Hodgkins Daniel
Neville, Jr. Robert J.
Data General Corporation
Thompson Gregory
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