Heatsink apparatus

Details Heatsink apparatus Heatsink apparatus

2006-02-14

2006-02-14

Duong, Hung Van (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C165S080300

Reexamination Certificate

active

06999312

ABSTRACT:
There is provided a computing apparatus. The computing apparatus has first and second computing elements and a heatsink thermally coupled to each of the first and second computing elements. A portion of the heatsink thermally coupled to the first computing element is thermally separated from a portion of the heatsink thermally coupled to the second computing element by a region having a reduced thermal conductivity.

REFERENCES:
patent: 5446619 (1995-08-01), Madsen et al.
patent: 5544012 (1996-08-01), Koike
patent: 5852547 (1998-12-01), Kitlas et al.
patent: 5937937 (1999-08-01), Sehmbey et al.
patent: 6130819 (2000-10-01), Lofland et al.
patent: 6330154 (2001-12-01), Fryers et al.
patent: 6367541 (2002-04-01), McCullough
patent: 6462948 (2002-10-01), Leija et al.
patent: 6556440 (2003-04-01), Jensen et al.
patent: 6661661 (2003-12-01), Gaynes et al.
patent: 6691768 (2004-02-01), Hsieh et al.
patent: 7321257 (1995-12-01), None
patent: 2001044674 (2001-02-01), None
International search report application No. GB0402382.6 mailed Jun. 15, 2004.
International search report application No. GB0402382.6 mailed Nov. 19, 2004.

Affiliated with

Also associated with

Rating

Heatsink apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heatsink apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heatsink apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3691599