Heatsink apparatus

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S695000, C165S080300

Reexamination Certificate

active

06999312

ABSTRACT:
There is provided a computing apparatus. The computing apparatus has first and second computing elements and a heatsink thermally coupled to each of the first and second computing elements. A portion of the heatsink thermally coupled to the first computing element is thermally separated from a portion of the heatsink thermally coupled to the second computing element by a region having a reduced thermal conductivity.

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patent: 5852547 (1998-12-01), Kitlas et al.
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patent: 6367541 (2002-04-01), McCullough
patent: 6462948 (2002-10-01), Leija et al.
patent: 6556440 (2003-04-01), Jensen et al.
patent: 6661661 (2003-12-01), Gaynes et al.
patent: 6691768 (2004-02-01), Hsieh et al.
patent: 7321257 (1995-12-01), None
patent: 2001044674 (2001-02-01), None
International search report application No. GB0402382.6 mailed Jun. 15, 2004.
International search report application No. GB0402382.6 mailed Nov. 19, 2004.

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