Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-02-14
2006-02-14
Duong, Hung Van (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C165S080300
Reexamination Certificate
active
06999312
ABSTRACT:
There is provided a computing apparatus. The computing apparatus has first and second computing elements and a heatsink thermally coupled to each of the first and second computing elements. A portion of the heatsink thermally coupled to the first computing element is thermally separated from a portion of the heatsink thermally coupled to the second computing element by a region having a reduced thermal conductivity.
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International search report application No. GB0402382.6 mailed Jun. 15, 2004.
International search report application No. GB0402382.6 mailed Nov. 19, 2004.
Burnham Andrew Stephen
Garnett Paul Jeffrey
Osborn Jay Kevin
Duong Hung Van
Kivlin B. Noäl
Meyertons Hood Kivlin Kowert & Goetzel P.C.
Sun Microsystems Inc.
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