Heatsink

Details Heatsink Heatsink

2007-10-23

2007-10-23

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080300, C165S185000, C257S722000, C361S703000, C361S719000

Reexamination Certificate

active

11019730

ABSTRACT:
Disclosed is a heatsink wherein a first bonding part for mounting the semiconductor component on a substrate and a second bonding part for mounting the heatsink on the substrate are soldered to the substrate by a common solder contact, so that the mounting the semiconductor component on the substrate, the mounting the heatsink on the substrate, and the fixing the heatsink to the semiconductor component can be implemented through a single soldering operation. Thus, the step of attaching the heatsink can be simplified. Since the solder is present in a clearance between the first and second bonding parts, the efficiency of heat dissipation can be enhanced.

REFERENCES:
patent: 3670215 (1972-06-01), Wilkens et al.
patent: 4605058 (1986-08-01), Wilens
patent: 4945401 (1990-07-01), Trunk et al.
patent: 5311395 (1994-05-01), McGaha et al.
patent: 50-11458 (1975-02-01), None
patent: 61-72878 (1986-05-01), None
patent: 62-91495 (1987-06-01), None
patent: 02-138761 (1990-05-01), None
patent: 08-088303 (1996-04-01), None

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