Heatsink

Details Heatsink Heatsink

2007-09-25

2007-09-25

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S721000, C174S015200, C174S016300, C165S080300, C165S080400, C165S104260

Reexamination Certificate

active

11074540

ABSTRACT:
A method according to one embodiment may include providing a heatsink having a base having a first region with a thickness greater than a second region. The heatsink may further include a plurality of fins extending from the base with at least one fin oriented at an angle to at least another fin. The method of this embodiment may also include thermally coupling the heatsink to the heat generating component. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

REFERENCES:
patent: 6308771 (2001-10-01), Tavassoli
patent: 6408935 (2002-06-01), DeHoff et al.
patent: 6512673 (2003-01-01), Wiley
patent: 6533028 (2003-03-01), Sato
patent: 6538888 (2003-03-01), Wei et al.
patent: 6691769 (2004-02-01), Johnson et al.
patent: 6704199 (2004-03-01), Wiley
patent: 6801428 (2004-10-01), Smith et al.
patent: 6883593 (2005-04-01), Johnson et al.
“Short Form Specification”,PICMG 3.0, (Jan. 2003), 34 pages.

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