Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2011-08-16
2011-08-16
Tucker, Philip C (Department: 1745)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S080000, C428S117000, C523S179000, C244S158700, C244S159100, C244S171700, C244S121000
Reexamination Certificate
active
07998295
ABSTRACT:
A method of forming a heat shield that involves thermally stabilizing a plurality of phenolic microspheres; mixing the thermally stabilized phenolic microspheres with a phenolic resin to form a phenolic ablative material; compressing the phenolic ablative material into a honeycomb core; and allowing the phenolic ablative material to cure.
REFERENCES:
patent: 3210233 (1965-10-01), Kummer et al.
patent: 3296153 (1967-01-01), Snogren
patent: 3697630 (1972-10-01), Yoshino
patent: 3956050 (1976-05-01), Dow et al.
patent: 6245407 (2001-06-01), Wang et al.
patent: 6716485 (2004-04-01), Wong et al.
patent: 2009/0202780 (2009-08-01), Loszewski et al.
patent: 01301329 (1989-12-01), None
Crooks Tab H.
Curry Edwin B.
Eichinger Jeffrey D.
Jones John S.
Muench Brian L.
Harness & Dickey & Pierce P.L.C.
Slawski Brian R
The Boeing Company
Tucker Philip C
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