Heating units for use in semiconductor-producing apparatuses and

Electric resistance heating devices – Heating devices – Radiant heater

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Details

118 725, 118 501, 118 728, 374208, H01L 21205, F26B 1900

Patent

active

054902282

ABSTRACT:
A wafer heater for use in a semiconductor producing apparatus or the like. The heater includes a discoidal substrate made of a dense ceramic, and a resistance heating element buried in the substrate. The surface of the substrate other than that surface upon which a wafer is to be placed for heating is a flat surface. The heating unit further includes a hollow sheath of which inner pressure is not substantially varied even when the pressure inside the chamber changes and is partially embedded and joined to the heater, and a thermocouple inserted into the hollow sheath.

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IBM Technical Diclosure Bulletin, "Novel Heat and Rotate Device for General Vacuum Thin Film Fabrication", vol. 32, No. 11, Apr. 1990, p. 12.

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