Heating method and manufacturing method for semiconductor device

Details Heating method and manufacturing method for semiconductor device Heating method and manufacturing method for semiconductor device

1995-01-30

1996-10-01

Bowers, Jr., Charles L.

Fishing, trapping, and vermin destroying

148DIG3, 148DIG6, 432 14, 437105, 117108, H01L 21324

Patent

active

055610889

ABSTRACT:
In a heating method for semiconductor devices, gas is filled in a heat chamber in which a heat target (semiconductor device) is mounted, and then the gas is compressed to produce heat. The heat target is heated to a desired temperature by the produced heat. Before the gas compression is performed, the heat target is preferably pre-heated by a heater.

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Translation of JP4-164188 Jun. 1992.

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