Heating element movement bonding method for semiconductor...

Details Heating element movement bonding method for semiconductor... Heating element movement bonding method for semiconductor...

2007-07-03

2007-07-03

Leung, Philip H. (Department: 3742)

Electric heating

Heating devices

Combined with pressure application means

C228S264000, C228S230000, C228S227000, C228S004100, C228S051000, C219S636000, C438S612000, C029S878000, C029S428000

Reexamination Certificate

active

11348482

ABSTRACT:
According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.

REFERENCES:
patent: 3850689 (1974-11-01), Basche et al.
patent: 4771932 (1988-09-01), Kim
patent: 4896019 (1990-01-01), Hyun
patent: 6539618 (2003-04-01), Lyke
patent: 6967307 (2005-11-01), Hembree et al.
patent: 7075036 (2006-07-01), Ogimoto et al.
patent: 2003/0019918 (2003-01-01), Farooq et al.
patent: 11-121531 (1999-04-01), None
patent: WO 02101815 (2002-12-01), None

Affiliated with

Also associated with

Rating

Heating element movement bonding method for semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heating element movement bonding method for semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heating element movement bonding method for semiconductor... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3793485