Heating element

Details Heating element Heating element

2007-07-26

2010-11-23

Ahmed, Shamim (Department: 1713)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S041000, C216S058000, C347S055000

Reexamination Certificate

active

07837886

ABSTRACT:
A method of making a printhead comprises forming a resistor strip in a heating region of the printhead. In a first portion of the heating region, a resistive layer is formed including a central resistor region interposed between two spaced apart conductive elements. In the method, a conductive layer is removed from a bus region of the printhead while protecting the first portion of the heating region.

REFERENCES:
patent: 4694306 (1987-09-01), Ikeda et al.
patent: 4716423 (1987-12-01), Chan et al.
patent: 4809428 (1989-03-01), Aden et al.
patent: 4866460 (1989-09-01), Shiozaki
patent: 5275695 (1994-01-01), Chang et al.
patent: 5376231 (1994-12-01), Matsumoto et al.
patent: 5450108 (1995-09-01), Drake et al.
patent: 5870121 (1999-02-01), Chan
patent: 5883650 (1999-03-01), Figueredo et al.
patent: 5942900 (1999-08-01), DeMeerleer et al.
patent: 6188414 (2001-02-01), Wong et al.
patent: 6331049 (2001-12-01), Leban
patent: 6347861 (2002-02-01), Tom et al.
patent: 6352338 (2002-03-01), Komuro
patent: 6443564 (2002-09-01), Keil et al.
patent: 6481831 (2002-11-01), Davis et al.
patent: 6513913 (2003-02-01), Schulte et al.
patent: 6558969 (2003-05-01), Miller et al.
patent: 6704996 (2004-03-01), Mrvos et al.
patent: 6719406 (2004-04-01), Silverbrook et al.
patent: 6767474 (2004-07-01), Trueba et al.
patent: 6785956 (2004-09-01), Xu et al.
patent: 6787049 (2004-09-01), Tom et al.
patent: 6838351 (2005-01-01), Sasaki et al.
patent: 7168157 (2007-01-01), Miller et al.
patent: 7198358 (2007-04-01), Sun et al.
patent: 2002/0158945 (2002-10-01), Miller et al.
patent: 2002/0158946 (2002-10-01), Schulte et al.
patent: 2003/0206216 (2003-11-01), Miller et al.
patent: 2004/0119789 (2004-06-01), Usami et al.
patent: 2006/0236537 (2006-10-01), Chen et al.
patent: 2007/0087484 (2007-04-01), Miller et al.
patent: 02-214671 (1990-08-01), None
patent: 07-171984 (1995-07-01), None
International Search Report for Application No. PCT/US2008/071149. Report issued Jan. 20, 2009.

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