Heating device for embodying connections by a meltable material

Details Heating device for embodying connections by a meltable material Heating device for embodying connections by a meltable material

1995-02-13

1997-06-10

Look, Edward K.

Heat exchange

Structural installation

Heating and cooling

165 61, 165 804, 219 8512, 2191216, 392419, F25B 2900

Patent

active

056366833

ABSTRACT:
A heating device is provided for connecting by means of a melting material to a connection support at least one component mounted on the support in at least one connection region at the periphery of the support. The device locally heats the support and/or the component in the connection region. Particular utility for the present invention is found in the area of production of flat display screens, although other utilities are also contemplated.

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Mori, Miki; et al., "A Fine Pitch COG Technique for a TFT-LCD Panel Using an Indium Alloy", Proceedings ECTC, 1993.
Tummala, Rao R.; et al., "Microelectronics Packaging Handbook", Jan. 1993, A Van Nostrand Reinhold Book, pp. 366-373.
Matsui, Koji; et al., "Resin and Flexible Metal Bumps for Chip-on-Glass Technology", Proceedings ECTC, 1993.
IBM Technical Disclosure Bulletin, vol. 32, No. 3A, Aug. 1989. pp. 453-455.

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