Heating device

Details Heating device Heating device

2007-11-14

2011-12-06

Hoang, Tu B (Department: 3742)

Electric heating

Heating devices

C219S634000

Reexamination Certificate

active

08071913

ABSTRACT:
A heating device includes an electrode embedded near the heating surface of the ceramic base substantially in parallel to the heating surface. In the rear surface of the ceramic base, a terminal hole extending toward the electrode is formed. Between the bottom surface of the terminal hole and electrode, a conductive ceramic member is embedded and connected to the electrode. The conductive ceramic member has a thermal expansion coefficient equal to that of the ceramic base. The electrode and terminal are electrically connected through the conductive ceramic member.

REFERENCES:
patent: 5633073 (1997-05-01), Cheung et al.
patent: 5817406 (1998-10-01), Cheung et al.
patent: 5995357 (1999-11-01), Ushikoshi et al.
patent: 6020076 (2000-02-01), Fujii et al.
patent: 6486542 (2002-11-01), Ohashi et al.
patent: 6590760 (2003-07-01), Fujii
patent: 6645304 (2003-11-01), Yamaguchi
patent: 6838646 (2005-01-01), Inazumachi et al.
patent: 7250215 (2007-07-01), Yoshikawa et al.
patent: 2002/0112820 (2002-08-01), Yamaguchi
patent: 2003/0080110 (2003-05-01), Hiramatsu et al.
patent: 2004/0207072 (2004-10-01), Hiramatsu et al.
patent: 2006/0213900 (2006-09-01), Matsuda et al.
patent: 08-277173 (1996-10-01), None
patent: 10-209255 (1998-08-01), None
patent: 2001-357965 (2001-12-01), None
patent: 2002-134590 (2002-05-01), None
patent: 2003-077781 (2003-03-01), None
patent: 2004-104113 (2004-04-01), None
patent: 2005-041765 (2005-02-01), None
patent: 2006-269826 (2006-10-01), None

Affiliated with

Also associated with

Rating

Heating device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Heating device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heating device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4298368