Heat exchange – Structural installation – Related to wall – floor or ceiling structure of a chamber
Patent
1997-11-12
2000-07-25
Leo, Leonard
Heat exchange
Structural installation
Related to wall, floor or ceiling structure of a chamber
165171, 219213, 219544, F24D 314, F24D 1302
Patent
active
060925876
ABSTRACT:
A heating/cooling system includes a plurality of solid panels which form part of a wall or floor. The panels are in the form of heating/cooling modules and incorporate a heat exchange element within the panel and in thermal contact with the material, e.g. chipboard, fibreboard or plywood, forming the panel. The panels can be provided with, for example, tongue and groove formations so that they can engage with like panels or with "industry-standard" panels which do not incorporate heat exchange elements.
REFERENCES:
patent: 3037746 (1962-06-01), Williams
patent: 4703597 (1987-11-01), Eggemar
patent: 4723598 (1988-02-01), Yoshio et al.
patent: 4782889 (1988-11-01), Bourne
patent: 4865120 (1989-09-01), Shiroki
patent: 4952775 (1990-08-01), Yokoyama et al.
patent: 5131458 (1992-07-01), Bourne et al.
patent: 5292065 (1994-03-01), Fiedrich
patent: 5740858 (1998-04-01), Ingram
Leo Leonard
Stoltz Melvin I.
LandOfFree
Heating/cooling systems does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heating/cooling systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heating/cooling systems will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1330116