Electric heating – Heating devices – Combined with container – enclosure – or support for material...
Patent
1997-02-27
2000-09-19
Beck, Shrive
Electric heating
Heating devices
Combined with container, enclosure, or support for material...
118730, 2194441, F27B 1100
Patent
active
061215791
ABSTRACT:
A heat treating apparatus comprises a process chamber within which a wafer is subjected to a heat treatment. A supporting plate for supporting the wafer is arranged within the process chamber. A process gas is supplied from above into the process chamber. A main heating means for heating the wafer is arranged below the process chamber, with a transmitting window interposed therebetween. The main heating means includes a plurality of heating sources for irradiating the supporting plate with heat rays so as to heat the wafer indirectly and a rotatable table having the heating sources arranged on the front surface thereof. The heat treating apparatus also comprises an auxiliary heating means for compensating for an uneven temperature caused on the surface of the wafer by the main heating means. The heating source of the auxiliary heating means is arranged on the surface of the rotatable table together with the heating sources of the main heating means, and the heat output from the heating source of the auxiliary heating means can be controlled independently of the heat output from the heating sources of the main heating means.
REFERENCES:
patent: 4469529 (1984-09-01), Mimura
patent: 5108792 (1992-04-01), Anderson et al.
patent: 5345534 (1994-09-01), Najm et al.
patent: 5551985 (1996-09-01), Brors et al.
patent: 5595606 (1997-01-01), Fujikawa et al.
patent: 5624499 (1997-04-01), Mizuno et al.
patent: 5650082 (1997-07-01), Anderson
patent: 5683518 (1997-11-01), Moore et al.
patent: 5708755 (1998-01-01), Gronet et al.
patent: 5711815 (1998-01-01), Lee et al.
patent: 5846476 (1998-12-01), Hwang et al.
patent: 5889258 (1999-03-01), Lubomirski et al.
patent: 5900177 (1999-05-01), Lecouras et al.
patent: 5937142 (1999-08-01), Moslehi et al.
patent: 5970214 (1999-10-01), Gat
Krishna C. Saraswat, et al., "Rapid Thermal Multiprocessing for a Programmable Factory for Adaptable Manufacturing of IC's", IEEE Transactions on Semiconductor Manufacturing, vol. 7, No. 2, May 1994, pp. 159-175.
Aoki Kazutsugu
Nomura Masamichi
Okase Wataru
Yagi Hironori
Beck Shrive
MacArthur Sylvia R.
Tokyo Electron Limited
LandOfFree
Heating apparatus, and processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heating apparatus, and processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heating apparatus, and processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1075507