Heating apparatus and method for semiconductor material slicing

Details Heating apparatus and method for semiconductor material slicing Heating apparatus and method for semiconductor material slicing

1990-09-10

1991-06-18

Rachuba, M.

Stone working

Work supports

125 1301, 51322, B28D 704

Patent

active

050242075

ABSTRACT:
A localized heating apparatus and method for breaking an adhesive joint between a mounting block of a semiconductor material slicing apparatus and a semiconductor material ingot, provide a more localized, and therefore faster, heating and cooling of the mounting block which reduces the time required for the semiconductor material slicing process.

REFERENCES:
patent: 4652135 (1987-03-01), Ono
patent: 4667650 (1987-05-01), Girard et al.

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