Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With bond interfering means
Reexamination Certificate
2005-09-27
2009-02-17
Tucker, Philip C (Department: 1791)
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With bond interfering means
C156S538000, C156S539000, C029S729000, C029S739000, C029S740000
Reexamination Certificate
active
07490652
ABSTRACT:
A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
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English Abstract of JP 61-158153.
Hosotani Naoto
Minamitani Shozo
Morita Koichi
Nishino Kenichi
Onobori Syunji
Chan Sing P
Panasonic Corporation
Tucker Philip C
Wenderoth , Lind & Ponack, L.L.P.
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