Heater chips with silicon die bonded on silicon substrate...

Details Heater chips with silicon die bonded on silicon substrate... Heater chips with silicon die bonded on silicon substrate...

2011-05-10

2011-05-10

Do, An H (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C029S890100

Reexamination Certificate

active

07938513

ABSTRACT:
A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.

REFERENCES:
patent: 6402301 (2002-06-01), Powers et al.
patent: 6502926 (2003-01-01), Cook et al.
patent: 6890067 (2005-05-01), Hock et al.
patent: 7109092 (2006-09-01), Tong

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