Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate
2007-11-06
2007-11-06
Stephens, Juanita D. (Department: 2853)
Incremental printing of symbolic information
Ink jet
Ejector mechanism
C347S050000
Reexamination Certificate
active
11241079
ABSTRACT:
Heater chips for use in printing devices, such as those including one or more ink vias and one or more heater arrays, where at least a portion of at least one the ink vias is associated with at least portions of at least two heater arrays. The first heater array can be adjacent to one side of at least a portion of the ink via and a second heater array can be adjacent to another side of at least a portion of the ink via. The heater chip can also include a bondpad supplying power to at least a portion of the first heater array and to at least a portion of the second heater array.
REFERENCES:
patent: 5030971 (1991-07-01), Drake et al.
patent: 5594488 (1997-01-01), Tsushima et al.
patent: 5646660 (1997-07-01), Murray
patent: 5731828 (1998-03-01), Ishinaga et al.
patent: 5812162 (1998-09-01), Silverbrook
patent: 6260952 (2001-07-01), Feinn et al.
patent: 6357863 (2002-03-01), Anderson et al.
patent: 6386674 (2002-05-01), Corrigan, III et al.
patent: 6398347 (2002-06-01), Torgerson et al.
patent: 6409315 (2002-06-01), Komuro
patent: 6488363 (2002-12-01), Torgerson et al.
patent: 6890064 (2005-05-01), Torgerson et al.
patent: 7008047 (2006-03-01), Conta et al.
Lexmark International Inc.
Stephens Juanita D.
Sutherland Asbill & Brennan
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