Heater assembly for thermal processing of a semiconductor wafer

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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Details

219343, 219390, 219405, 219354, H05B 322

Patent

active

044814062

ABSTRACT:
A heater assembly for annealing a semiconductor wafer in a vacuum chamber includes a blackbody source having a constant planar energy flux charactertistic and a wafer support for supporting the wafer adjacent to, but not spaced apart from, the source in planar parallel alignment therewith. The heater assembly further includes radiation shields and a housing providing support for the source, the wafer support and the radiation shields in fixed relationship. The housing includes a heat sink for removal of thermal energy and a slot for insertion and removal of the wafer. The heater assembly confines thermal energy and reduces input energy requirements. In addition, the requirement for a movable shutter is eliminated.

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